MANUFACTURE OF MULTILAYER PRINTED WIRING BOARD

摘要

PROBLEM TO BE SOLVED: To provide a manufacturing method of a multilayer printed wiring board with excellent etching precision of interlayer connecting holes. SOLUTION: In this manufacture of a multilayer printed wiring board using an epoxy resin curing compound containing halogen atoms for insulating layers, interlayer connecting holes are formed by removing the resin curing compound provided in the portions to be the interlayer connecting holes by using an etching solution consisting of alkali metal compounds, an amide solvent and an alcohol solvent and the etching solution is filtrated during the treatment.