METAL CIRCUIT BOARD, MANUFACTURE THEREOF, AND SEMICONDUCTOR DEVICE USING THE SAME

摘要

PROBLEM TO BE SOLVED: To easily form an electric circuit pattern of large thickness by constructing an insulating layer consisting of two insulating layers or more between a first metal plate and a second metal plate, and at least a part of the second metal plate is covered by the resin layer that contacts the side surfaces of the second metal plate. SOLUTION: A resin coating film 2 of 130μm thickness is formed by coating an aluminum substrate 1 of 2 mm thickness with varnish by screen-printing (a). The aluminum substrate 1 having a resin-covering film of 111μm thickness is formed by heat treatment (b). An 80μm thick resin-coating film 3 is newly formed by screen-printing epoxy resin varnish on the resin-covering film (c). The solvent is mostly evaporated by a heat treatment, and a viscous resin- coating film 3 is obtained (d). A lead frame is mounted (e), and is subjected to a heating-and-pressurizing process for 30 minutes (f) to adhere the lead frame (g). On the side surfaces of the lead frame, fillet shapes 5 are formed by the resin flowed out in the heating-and-pressurizing process.