发明名称 FLEXIBLE WIRING BOARD
摘要 PROBLEM TO BE SOLVED: To obtain a sufficient flexibility life even under the operating condition in a high temperature by making an average value of a compound shearing elasticity coefficient in a specific condition of each contact agent layer directly contacting both surfaces of a conductive layer. SOLUTION: This flexible wiring board comprises a basic member of three layered, for examples, a plastic film BP, a contact agent layer BAd and a metallic foil M, and a covering layer C comprising two layers of a plastic film CP for the covering layer and a contact agent layer CAd to be laminated. Here, a value of compound shearing elasticity coefficient of each contact agent layer BAd and CAd at 60 deg.C and 25 Hz is made to be 1.0×1010 to 4×1010 dyn/cm2. In the case a value of compound shearing elasticity coefficient being less than 1.0×1010 dyn/cm2, a sufficient flexible life cannot be obtained. Or in the case of exceeding 4×1010 dyn/cm2, a phenomenon of becoming the life shorter is easily generated caused by brittleness, and also flexibility as a flexible wiring board is lost.
申请公布号 JP2000151030(A) 申请公布日期 2000.05.30
申请号 JP19980328157 申请日期 1998.11.18
申请人 NITTO DENKO CORP 发明人 MIYAAKE NORIHARU;MIYAKE YASUFUMI;TERADA TETSUYA
分类号 H05K1/02;B32B7/12;H05K1/03;H05K3/28;(IPC1-7):H05K1/02 主分类号 H05K1/02
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