发明名称 SEMICONDUCTOR DEVICE AND FABRICATION THEREOF
摘要 PROBLEM TO BE SOLVED: To prevent a gate oxide film from being damaged without sacrifice of charging damage suppressing effect by employing a structure where a gate electrode is connected directly with a protective diode through the upper layer metal of a two layer gate electrode. SOLUTION: A polysilicon layer 6 and a tungsten silicide layer 7 are patterned to form a gate electrode. Since a gate electrode is connected directly with protective diodes 4a, 4b through the tungsten silicide 7, charges being generated in the patterning and subsequent steps and applied to a gate oxide film 5 can be released to a P type silicon substrate 1. Since charges are prevented from concentrating on the gate oxide film 5, the gate oxide film 5 is protected against damage and thereby deterioration. Consequently, a stabilized threshold voltage can be formed in an MOS transistor.
申请公布号 JP2000150666(A) 申请公布日期 2000.05.30
申请号 JP19980314769 申请日期 1998.11.05
申请人 NEC CORP 发明人 MASUDA SHUICHI
分类号 H01L21/768;H01L21/28;H01L21/822;H01L21/8238;H01L27/04;H01L27/092;(IPC1-7):H01L21/823 主分类号 H01L21/768
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