发明名称 Photo sensor integrated circuit
摘要 A photo diode and a signal processing circuit are formed on a silicon substrate. The signal processing circuit comprises a PNP transistor and an NPN transistor. A region of the signal processing circuit on the silicon substrate is covered by an aluminum thin film functioning as a shielding film. A covered distance L( mu m) is defined as an overhang of the aluminum thin film from the edge of the PNP transistor, and is determined based on a ratio of a minimum current of the PNP transistor, which induces malfunction in the signal processing circuit under the solar radiation, to a current generated in the circuit element when subjected to the solar radiation without the aluminum thin film.
申请公布号 US6069378(A) 申请公布日期 2000.05.30
申请号 US19970985043 申请日期 1997.12.04
申请人 DENSO CORPORATION 发明人 TOYODA, INAO;SUZUKI, YASUTOSHI;INOUE, KEIJIRO
分类号 H01L27/14;H01L27/144;H01L31/10;(IPC1-7):H01L31/062;H01L31/113;H01L31/020;H01L31/023 主分类号 H01L27/14
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