| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a lead frame, a semiconductor device using it and its production method by which the adhesion to packaging resin can be kept, even when the rear surface of a semiconductor element is exposed, and the formation of nonfilled area be eliminated during resin packaging. SOLUTION: A small die pad 41 is constituted of recessed joint parts 42a, 42b, 42c, and 42d and a lead frame having the die pad 41 smaller than a semiconductor element to be mounted is used, so that the adhesion top packaging resin can be kept, a stress generating therebetween being released, and the occurrence of package cracks be prevented in a reflow step. When the die pad 41 is subject to resin packaging, since a resin injected from a resin gate port 43 becomes lower in resistance to resin flow on the rear surface of the die pad 41 because of the die pad 41 having a recessed part, the velocity of resin flow on the rear surface is made constant, thereby preventing the formation of nonfilled voids.</p> |
