| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a semiconductor package in which a semiconductor device capable of surface mounting on an outer circuit board in the state that a semiconductor chip and a circuit part are sufficiently sealed can be formed, and terminals whose reliability is improved can be easily formed. SOLUTION: A circuit board 21 having a recessed part 2 on which a semiconductor chip is mounted, and a circuit part 5 arranged on a shoulder part 3 in the peripheral part of the recessed part 2 is formed. An insulating layer 8 having through holes 7 is laminated on the circuit part 5 of the circuit board 21. Through hole conducting paths 4, whose lower end portions are connected electrically with the circuit part 5 penetrating the through holes 7, and whose upper end portions protrude from the upper surface of the insulating layer 8, are formed. The upper end portions of the through hole conducting paths 4 are formed on terminals 6 for surface mounting which are arranged on the same side as the recessed part 2 and the shoulder part 3 on the circuit board 21.</p> |
