发明名称 |
SPUTTERING TARGET AND ITS MANUFACTURE |
摘要 |
PROBLEM TO BE SOLVED: To prevent the occurrence of abnormal electric discharge due to the division sections of a target having the division sections and to prevent the adhesion of particles due to the abnormal electric discharge. SOLUTION: In a multidivision-type sputtering target constituted by joining plural target members onto a backing plate by the use of a bounding agent, clearances between respective target members are filled. with an alloy having a melting point higher than that of the bonding agent or an alloy capable of filling the clearances between respective target members at a temperature below the melting point of the bonding agent and having a melting point higher than that of the bonding agent after the completion of filling.
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申请公布号 |
JP2000144400(A) |
申请公布日期 |
2000.05.26 |
申请号 |
JP19990027032 |
申请日期 |
1999.02.04 |
申请人 |
TOSOH CORP |
发明人 |
UCHIUMI KENTARO;ITO KENICHI;TAKAHATA TSUTOMU |
分类号 |
C23C14/34;(IPC1-7):C23C14/34 |
主分类号 |
C23C14/34 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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