发明名称 SPUTTERING TARGET AND ITS MANUFACTURE
摘要 PROBLEM TO BE SOLVED: To prevent the occurrence of abnormal electric discharge due to the division sections of a target having the division sections and to prevent the adhesion of particles due to the abnormal electric discharge. SOLUTION: In a multidivision-type sputtering target constituted by joining plural target members onto a backing plate by the use of a bounding agent, clearances between respective target members are filled. with an alloy having a melting point higher than that of the bonding agent or an alloy capable of filling the clearances between respective target members at a temperature below the melting point of the bonding agent and having a melting point higher than that of the bonding agent after the completion of filling.
申请公布号 JP2000144400(A) 申请公布日期 2000.05.26
申请号 JP19990027032 申请日期 1999.02.04
申请人 TOSOH CORP 发明人 UCHIUMI KENTARO;ITO KENICHI;TAKAHATA TSUTOMU
分类号 C23C14/34;(IPC1-7):C23C14/34 主分类号 C23C14/34
代理机构 代理人
主权项
地址