发明名称 LAYING FLOOR STRUCTURE
摘要 PROBLEM TO BE SOLVED: To make a floor substrate panel absorb moisture under the floor, and eliminate a fear of dimensional stability caused by the occurrence of expansion, contraction, and warpage by forming the floor substrate panel with a moisture-proofing layer formed on the lower surface of a moisture-absorbing base plate, and forming the moisture-proofing layer of a polyolefin resin sheet. SOLUTION: A floor substrate panel 2 being resiliently supported by short legs 1 is placed on a floor baserock 3, and flooring material 4 is provided on the panel 2. Also, panel 2 is that a moisture-proofing layer 6 is formed on the lower surface of a moisture-absorbing base plate 5, and the moisture proofing layer 6 is formed of a polyolefin resin sheet 7, then adhering paper 8 on the upper surface of the moisture-absorbing base plate 5. Herein, in order to adhere the polyolefin resin sheet 7 to the moisture-absorbing base plate 7, the sheet 7 is activated by a plasma discharge treatment and corona discharge treatment to be adhered by an adhesive. In this manner, by carrying out a discharge treatment to the sheet 7, melting is not required, and adhering work becomes easy.
申请公布号 JP2000145103(A) 申请公布日期 2000.05.26
申请号 JP19990233004 申请日期 1999.08.19
申请人 BRIDGESTONE CORP 发明人 TSUKADA SUSUMU;YAMANAKA MASANAO;HITOMI HISAO;UENISHI NOBUAKI;YANAGI HIDESHI;EGUCHI SHINICHI
分类号 E04F15/00;E04F15/18;(IPC1-7):E04F15/00 主分类号 E04F15/00
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