| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for keeping a metal ion concn. and concn. ratio of a plating bath always constant for obtaining stable coating film composition at the time of producing the cathode for electrolytic industry by coating an electrically conductive substrate with the electrodeposit exhibiting low-hydrogen overvoltage performance, having a relatively large thickness of tens to hundreds ofμm and consisting essentially of nickel-iron. SOLUTION: A plating bath, in which at least nickel ion, iron ion and a complexing agent coexist, is used to plate an electrically conductive substrate with an electrodeposit exhibiting a low-hydrogen overvoltage, and a low- hydrogen overvoltage electrode is produced. In this method, the concns. and concn. ratio of the nickel ion and iron ion are kept constant in the plating bath by replenishing or removing the ions by the amt. corresponding to the nickel ion and iron ion varying with the electroplatings.
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