Method for soldering metallic construction parts equipped with corrosion protection layers containing semiconductor material as filler which is excited into its conducting state during soldering

摘要

Method for soldering metallic construction parts equipped with corrosion protection layers comprising 3-80 wt.% binder and 20-97 wt.% filler in a semiconductor and/or semiconductor compounds is/are added to the filler material is claimed; in which semiconductor is excited into its conducting state by an external energy supply during soldering. An Independent claim is also included for a protection layer for said method.