| 摘要 |
PROBLEM TO BE SOLVED: To obtain the subject composition having no problem such as curing inhibition, etc., by a blowing agent, etc., a low thermal conduction and excellent heat storage properties by mixing a thermosetting organopolysiloxane composition with a hollow filler having an average particle diameter smaller than a specific value. SOLUTION: This composition is obtained by mixing 100 pts.wt. of a thermosetting organopolysiloxane composition with 0.1-200 pts.wt. of a hollow filler having <=200μm average particle diameter. A composition consisting essentially of (A) 100 pts.wt. of an organopolysiloxane containing two or more alkenyls bonded to a Si atom, (B) 0.1-50 pts.wt. of an organohydrogenpolysiloxane containing two or more H atoms bonded to a Si atom and (C) a catalytic amount of an addition reaction catalyst is preferable as the composition. A hollow balloon made of a thermoplastic resin such as a vinylidene chloride polymer, etc., is preferable as the hollow filler. The hollow filler has preferably 0.02-0.5 true specific gravity.
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