| 摘要 |
PROBLEM TO BE SOLVED: To obtain a resin composition having low water absorption, solder heat resistance, heat resistance and adhesiveness, bondable especially at a low temperature by mixing a specific polyimide resin with an epoxy resin. SOLUTION: This composition comprises (A) a polyimide resin obtained by reacting (i) an ester acid dianhydride of formula I (X is an aromatic ring- containing bifunctional group) with (ii) a diamine of formula II (Y is -SO2, -O- or the like; m and n are each 1-10) and (iii) a siloxanediamine of formula III (R1 and R2 are each a bifunctional 1-4C aliphatic group or bifunctional aromatic group; R3 to R6 are each a monofunctional 1-4C aliphatic group or a monofunctional aromatic group) and (B) an epoxy resin. 3,3',4,4'-Ethylene glycol benzoate tetracarboxylic dianhydride, etc., are preferable as the component (i). For example,α,ω-bis(3-aminopropyl)polydimethylsiloxane, etc., may be cited as the component (iii). The ratio of the component (iii) to the whole diamine is preferably 1-30 mol%.
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