发明名称 RESIN COMPOSITION FOR LIQUID SEALING
摘要 PROBLEM TO BE SOLVED: To obtain the subject composition having fluidity suitable for sealing potting operation, etc., moisture resistance standing PCT in the absence of a solvent or in the presence of a small amount of a solvent by making the composition include a liquid epoxy resin, a specific phenol resin, a filler, etc. SOLUTION: This resin comprises (A) a liquid epoxy resin, (B) a phenol resin of the formula (R1 to R5 are each a 1-5C alkyl or H; 70-80% of a phenol resin wherein n is 0 is contained), (C) a filler, (D) a curing promoter and (E) a coupling agent as essential components. For example, a bisphenol A type epoxy resin is used as the component A, a phenol novolak resin, etc., are used as the component B. The blending ratio of the component B is 0.3-1.2 equivalent of OH equivalent of the component B based on 1 equivalent of the epoxy group of the component A. Fused silica having 20μm average particle diameter, etc., are used as the component C and 1-benzyl-2-phenylimidazole, etc., are used as the component D.
申请公布号 JP2000143774(A) 申请公布日期 2000.05.26
申请号 JP19980325736 申请日期 1998.11.17
申请人 TOSHIBA CHEM CORP 发明人 KIKUCHI MIEKO
分类号 H01L23/10;C08G59/62;C08K3/00;C08L63/00;(IPC1-7):C08G59/62 主分类号 H01L23/10
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