| 摘要 |
<p>PROBLEM TO BE SOLVED: To produce an Sn-contg. copper alloy material excellent in solderability and to provide a method for confirming the quality thereof. SOLUTION: In this Sn-contg. copper alloy material, the Sn3d/Cu2p ratio in the peak area ratio of the quantitative analysis in the case the surface is measured by X-ray photoelectron spectroscopy is controlled to <=0.3. For this purpose, there is a need of controlling the oxidation of Sn in the surface of the stock, concretely of controlling the annealing atmosphere or the pickling method after annealing in the producing process to the proper one. Moreover, the crystal grain size measured in the direction perpendicular to the rolling direction in the surface is controlled to <=30μm.</p> |
