发明名称 PERIPHERY SAGGING MEASUREMENT OF SEMICONDUCTOR SUBSTRATE
摘要 PROBLEM TO BE SOLVED: To attain the quantitative evaluation of surface flatness by mounting one end surface of a semiconductor substrate on an optical flat, and scanning from the vertical surface of a block gauge to the surface of the semiconductor substrate by means of a stylus on a surface roughness measuring device. SOLUTION: A block gauge 2 is put on an optical flat 1 with clay. The end surface 2a of the block gauge 2 is perpendicular to the optical flat 1, and the substrate 3 is brought into close contact with the end surface 2a of the block gauge 2. The angle of the front end part of a stylus 4 to be used is 45-90 degree, and the radius of curvature of the front end part is 2-10μm. The stylus 4 is moved from the block gauge 2 to the substrate 3 in this formation, and moved from the point where the stylus 4 separates from the block gauge 2 to a prescribed point to accommodate the surface shape of the outer-periphery of the substrate 3 by a prescribed distance. The travel speed of the stylus 4 scans at a prescribed slow speed.
申请公布号 JP2000146569(A) 申请公布日期 2000.05.26
申请号 JP19990025532 申请日期 1999.02.02
申请人 SHOWA DENKO KK 发明人 KIMURA MASAHIRO;DAIO HIROSHI;YAKUSHIJI KENJI;SAITO YASUO
分类号 G01B5/28;G01B21/30;H01L21/66;(IPC1-7):G01B21/30 主分类号 G01B5/28
代理机构 代理人
主权项
地址