发明名称 FORMATION OF FILM ON ROLL FILM AND FILM FORMING DEVICE
摘要 PROBLEM TO BE SOLVED: To control the flow rate of reactive gas in the vicinity of the center in the width direction of a roll film in-line and to control the shape of the distribution of the film thickness in the width direction to the almost flat one. SOLUTION: Reactive gas used at the time of a film forming process to a roll film by reactive sputtering is fed over the whole in the width direction of the roll film from the main pipe 8 in a vacuum chamber so as to control the flow rate so that a film thickness distribution with a projecting shape in which the film is thickened from both end parts in the width direction of the roll film toward the vicinity of the center can be obtd. (1st stage) and is next fed only to the vicinity of the center in the width direction of the roll film by an auxiliary pipe 9 in the vicinity of the main pipe 8 so as to increase the flow rate of the reactive gas (2nd stage). The control of the flow rates of the reactive gas to be introduced into the main pipe 8 and the auxiliary pipe 9 is executed at the outside, and the 1st stage and the 2nd stage are continuously executed without stopping the film forming process.
申请公布号 JP2000144403(A) 申请公布日期 2000.05.26
申请号 JP19980320116 申请日期 1998.11.11
申请人 SONY CORP 发明人 OSHIMA YOSHIHIRO;KAKINUMA MASAYASU
分类号 C08J5/18;B32B9/00;C23C14/34;C23C14/56;(IPC1-7):C23C14/34 主分类号 C08J5/18
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