发明名称 ELECTROLESS SILVER PLATING SOLUTION FOR ELECTRONIC PARTS
摘要 PROBLEM TO BE SOLVED: To provide an electroless silver plating sol. for electronic parts having migration preventing effect and having a long plating bath life. SOLUTION: This plating soln. is composed of silver salt, a complexing agent of silver, a fluorine surfactant and PH buffer salt. The silver salt is composed of silver nitrate, and the complexing agent of silver is composed of a pyrolidone compd. It contains 0.05 to 30 g/l silver ions, 0.1 to 200 g/l pyrolidone compd. and 0.01 to 10 g/l fluorine surfactant, and as the PH buffer salt, inorganic acid or organic acid or both are contained. The pyrolidone compd. is at least one kind among 2-pyrolidone, 3-pyrolidone and 2-pyrolidone-5- carboxylic acid.
申请公布号 JP2000144440(A) 申请公布日期 2000.05.26
申请号 JP19980328373 申请日期 1998.11.18
申请人 NIPPON KOJUNDO KAGAKU KK 发明人 SERIZAWA SEIICHI;IGAWA MASAHIRO;TAKASAKI TAKAHARU
分类号 C23C18/42;H05K3/24;(IPC1-7):C23C18/42 主分类号 C23C18/42
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