发明名称 MANUFACTURE OF MASK FOR EXPOSURE
摘要 <p>PROBLEM TO BE SOLVED: To enable a device area to be properly arranged at a high speed by providing the manufacturing method of a mask for exposure by which the plural kinds of chips having different sizes are easily inputted and set and the device area can be optimally arranged while securing a prescribed scribe area. SOLUTION: In this manufacturing method of the mask for exposure, processing that coordinate information for demarcating the rectangular device area and a condition for regulating the scribe area are inputted as parameters (S11), processing that the device area is arranged based on the coordinate information inputted as the input parameter (S13), processing that the scribe area is set by being adjacent to the device area based on the condition for regulating the scribe area (S15) and processing that a light shielding band area is set at least outside the device area and the scribe area (S16) are included.</p>
申请公布号 JP2000147742(A) 申请公布日期 2000.05.26
申请号 JP19980321990 申请日期 1998.11.12
申请人 FUJITSU LTD 发明人 ITATSU TOSHIHIKO
分类号 H01L21/027;G03F1/68;(IPC1-7):G03F1/08 主分类号 H01L21/027
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