发明名称 |
ADHESIVE RESIN COMPOSITION |
摘要 |
PROBLEM TO BE SOLVED: To provide an adhesive resin composition which can not only decrease internal stress of the interface between a metal and an adhesive layer thereby improving cathodic peeling but also enhance adhesion strength, especially an adhesive resin composition improved in cathodic peeling and adhesion strength in a high temperature range where a polypropylene is used as a covering resin. SOLUTION: There is provided a resin composition comprising a polypropylene having a flexural stiffness at 23 deg.C of at least 400 MPa (component (A)) and a copolymer elastomer of propylene with anα-olefin containing 50-90 wt.% of propylene (component (B)), wherein the wt. ratio of the component (A) to the component (B) is in the range of 50/50 to 95/5 and at least one of the components (A) and (B) contains a product modified with an unsaturated carboxylic acid or an anhydride thereof so that the content of the unsaturated carboxylic acid or the anhydride thereof is at least 0.01 wt.% based on the total amount of the components (A) and (B).
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申请公布号 |
JP2000143899(A) |
申请公布日期 |
2000.05.26 |
申请号 |
JP19980313821 |
申请日期 |
1998.11.05 |
申请人 |
MITSUBISHI CHEMICALS CORP |
发明人 |
SANOU AKIHISA;HATTORI MASABUMI |
分类号 |
B32B27/32;C08L23/10;C08L23/26;(IPC1-7):C08L23/10 |
主分类号 |
B32B27/32 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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