发明名称 LIGHT POSTCURABLE ADHESIVE COMPOSITION AND BONDING OF PARTS
摘要 PROBLEM TO BE SOLVED: To obtain a light postcurable adhesive compsn. which shows a suffi cient pressure-sensitive adhesivity at an initial stage, ensures a sufficient avail able application time after light irradiation, and furnishes an excellent adhesive strength after curing. SOLUTION: This is a light postcurable adhesive compsn. contg. a cationically polymerizable compd. (A) having at least one cationically polymerizable group in one molecule, a photopolymerization initiator (B) which can polymerize or cure the cationically polymerizable compd. (A) with light irradiation, and at least one type of polymer (C). When the photopolymerization initiator (B) is activated by irradiating this adhesive compsn. with light, the conversion rate of the cationically polymerizable compd. (A) exceeds 10% in the time range of 5 min to 5 hr at 25 deg.C. Furthermore, the conversion rate is 50% or more when aged at 25 deg.C for 7 days.
申请公布号 JP2000144094(A) 申请公布日期 2000.05.26
申请号 JP19980328177 申请日期 1998.11.18
申请人 SEKISUI CHEM CO LTD 发明人 FUKUI KOJI
分类号 C08G59/68;C09J5/00;C09J163/00;C09J201/02;(IPC1-7):C09J201/02 主分类号 C08G59/68
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