PRODUCTION METHOD OF PCB SHEET FOR SEMICONDUCTOR PACKAGE

摘要

PURPOSE: A production method of a PCB sheet is provided to easily connect electrically with a bond finger located in an outer circumference of a through portion by positioning an I/O pad of a semiconductor chip at a lower face of the through portion and to isolate many circuit patterns electrically from a stiffener pattern. CONSTITUTION: A production method of a PCB sheet contains the steps of: producing an initial PCB sheet(10') for plating a copper thin film on a plate shaped polyimid layer, forming a first bus line on a peripheral rim of the initial PCB sheet(10), forming a stiffener pattern(15) of a square ring shape in an inner circumference, forming a second bus line connected to the stiffener pattern and forming many bond fingers(17), a junction(18), and a solder ball land(19), coating a whole upper surface except the bond finger and the solder ball land with insulating cover coat(20), electroplating Ag(41), Au, Ni(42) on the bond finger(17) and the solder ball land(19) among circuit patterns, cutting the second bus line where the stiffener pattern and the bond finger, positioning the I/O pad(31) of the semiconductor chip(30) at a lower part of the through portion by forming the through portion(21) by cutting to the polyimid layer of the lower part, and isolating the solder ball land and the junction and the bond finger from the stiffener pattern.