| 摘要 |
PURPOSE: An equipping device of a semiconductor is provided to move a chip while having a position accuracy over a specific distance. CONSTITUTION: An equipping device of a semiconductor is composed of a wafer table(3), a first driving device(7), a second driving device(8), and a device(9) for transporting and storing a substrate(10). The first driving device is a U-shaped stator(14) in an inner space, which contains a projected coil(16) fixed at a slide(6). The stator has a magnet(17) aligned along a y-direction at both faces of the inner space for representing N pole or S pole in turn. An opposite magnet(17) forms a pair of magnets having an N pole and an S pole. The coil includes rectangular plural electric wires. Herein, a combination structure between the wire and the magnet for deciding a driving force does not move by the vertical movement of the coil for a certain distance.
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