DEVICE FOR ETCHING USED TO PRODUCTION OF SEMICONDUCTOR DEVICE

摘要

PURPOSE: A device for etching is provided to improve the etching uniformity with controlling the temperature for each part needed a chuck by equipping a first-a third cooling supply ports, a first-a third cooling line and a first-a third cooling return ports. CONSTITUTION: An etching device is arranged a chamber(21) and a chuck(23) put a wafer inside the chamber(21). A support bar(25) is formed in the upper face of the chuck(23), a first-a third cooling supply ports(27a-27c), a first-a third cooling lines(29a-29c) connected each in the first-the third cooling supply ports(27a-27c), and a first and a third cooling return ports(31a-31c) connected each in the first-the third cooling lines(29a-29c) are formed in the support bar(25). A dividing bar(33) is formed to divide between the first-the third cooling lines(29a-29c). The dividing bar is able to be composed of a space. A cooling medium passed the first-the third cooling support ports(27a-27c) is exhausted through the first-the third cooling return ports(31a-31c) after cooling the chuck(23) during moving according to the first-the third cooling lines(29a-29c) to an arrow direction. Therefore, the etching uniformity is increased by rising/falling the different of etching speed of a center part and an edge part of the chuck(23) and the temperature of the chuck through the first-the third cooling lines(29a-29c).