| 摘要 |
PURPOSE: An addition-curable silicone composition, method for the preparation thereof and silicone elastomer therefrom are provided which show excellent adhesive property to a wide range of materials and are useful as a sealing material particularly in chip scale or size semiconductor packages. CONSTITUTION: An addition-curable silicone composition containing a silicone compound, in particular organopolysiloxane resins having their molecular weight restricted in a critical concentration is described. The composition comprises (A)100 parts by weight of a polydiorganosiloxane containing at least two alkenyl groups bonded to the silicon atoms in one molecule, (B)from 75 to 150 parts by weight of an organopolyoxysiloxane resin containing a number average molecular weight of 2,000 to 5,000 and a unit of R¬32R¬4SiO1/2 and SiO4/2, (C)organohydrogenpolysiloxanes having at least 3 hydrogen atoms bonded to the silicon atoms in one molecule in an amount of providing 1 to 3 hydrogen atoms bonded to the silicon atoms per an alkenyl group in the combined component (A) and (B), (D)an adhesion accelerator in an amount of adhering the composition to a base plate, and (E)a hydrosilylation catalyst in an amount of curing the composition. The composition forms an elastomer showing a low coefficient of thermal expansion and storage modulus. |
