| 摘要 |
PURPOSE: A method for bonding an integrated circuit chip to a support substrate is provided to selectively supply the effect of Under Bump Metallization(UBM) by using a blanket deposition, a lithography masking, and an etching method. CONSTITUTION: An oxide, a capping layer, and an aluminum bonding zone are formed on a substrate(51). And an aluminum UMB layer is deposited by sputtering. And a copper layer of UBM is sputtered on the aluminum for having the thickness of 0.2-2 micrometers. Herein, the UBM layers are successively deposited without breaking a vacuum state. Then, a photoresist etching mask is supplied for masking a soldering bump area. The copper layer and the deposited aluminum layer are etched by arranging a photo mask in a set position and by using traditional etching raw material. Finally, the photo mask is eliminated for supplying a solder bump or a solder ball(58). |
