| 发明名称 |
SEMICONDUCTOR DEVICE HAVING EXTERNAL CONNECTING TERMINAL AND PRODUCING METHOD THEREOF |
| 摘要 |
<p>PURPOSE: A semiconductor device is provided to contain buffering characteristic while packaging an external connecting terminal and to handle the semiconductor device more easily. CONSTITUTION: A rewiring unit(18) formed on a forming surface of electrode terminal is covered by an insulating resin(30) while an external connecting terminal(12) is exposed from a base. Therefore, the rewiring unit is protected. And a short of electric circuit between lead wires caused by attaching solder to the rewiring unit and a movement between the adjacent rewiring units are prevented. Therefore, a semiconductor device does not cause short of electric circuit between lead wiring for packaging stably.</p> |
| 申请公布号 |
KR20000029392(A) |
申请公布日期 |
2000.05.25 |
| 申请号 |
KR19990047257 |
申请日期 |
1999.10.28 |
| 申请人 |
SHINKO ELECTRIC INDUSTRIES CO., LTD. |
发明人 |
HIKASHI MISUTOSHI;SAKAGUCHI HIDEAKI;IMAI KAZUNARI;KYOZUKA MASAHIRO;SHIMIZU MISUHARU |
| 分类号 |
H01L23/52;H01L21/56;H01L21/60;H01L23/31;H01L23/485;(IPC1-7):H01L23/52 |
主分类号 |
H01L23/52 |
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