| 摘要 |
PURPOSE: A preparation method of a composite foil for preparation of a printed circuit board is provided to perform laser processing for the formation of a hole on a copper-clad laminate formed by using the composite foil for forming a printed circuit board without forming a burr on the laminate even by weak output of laser. CONSTITUTION: A composite foil(21) includes a carrier(22), an organic release layer(23) folded on the surface of the carrier, and a conductive particle layer(24) formed on the organic release layer for enabling to be released. The carrier is formed by one material selected from copper foil, copper composite foil, aluminum foil, copper-plated aluminum foil, zinc-plated aluminum foil, or metal foil including the foil of stainless steel. The organic release layer is to be formed by one organic compound selected from the groups of nitrogen-contained compound, sulfur-contained compound, or carboxyl acid. The conductive fine particles composing the conductive particle layer contains metal such as copper, silver, gold, platinum, zinc, nickel, metal alloy thereof, inorganic compound such as iridium oxide or tartar oxide, and organic compound such as poly aniline.
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