PRODUCING METHOD FOR SEMICONDUCTOR PACKAGE

摘要

PURPOSE: A method for producing a semiconductor package is provided to increase the number of solder balls and to support the solder balls firmly by locating the solder ball, which is a final input and output terminal at the outer circumference of a semiconductor chip. CONSTITUTION: An original rigid circuit is produced by coating a thin copper film on a prepreg(12). And the thin copper film is selectively eliminated for forming fine circuit patterns such as a bond finger(13), a connecting unit, and a solder ball land(15) on the surface of the prepreg. Then, an insulating cover coat(16) is coated on the surface of the prepreg other than the fine circuit patterns. A rigid circuit(10) is produced by forming a space unit in a certain area for locating the central upper surface of a semiconductor chip. Therefore, the upper surface of the semiconductor chip is attached on the lower surface of the rigid circuit. And then, the bond finger is bonded by using a conductive wire(50) such as gold or aluminum. And an encapsulation(60) is filled in the space unit on the rigid circuit for protecting the conductive wire from outside, and a solder ball(70) is settled in the solder ball land to be inputted to a hot furnace for melting and attaching the solder ball to the solder ball land. Then, the rigid circuit is singulated to a semiconductor package to complete the semiconductor package.