METHOD FOR PRODUCING IC CARD

摘要

PURPOSE: A method for producing an IC card is provided not to generate the disconnection with the change of a conductive wire generated by adding the outer force in the direction crossed a plane coil when the plane coil is sent or assembled in the producing process of IC card. CONSTITUTION: A frame for an IC card(10) is formed by etching or compressively molding a metal foil. An inner frame(14) and an outer frame(16) are installed by having a certain interval each other in the outside and the inside. A plane coil(12) formed in the frame(10) used to the IC card is square, and formed bent parts(22,22,...) in a straight part of the plane coil(12). The bent part(22) is formed to form bent part projected inside the plane coil(12) in the same position of each conducting wire(2). The hardness is improved by forming the bent part(22) in the plane coil(12). Even though the outer force is added to the direction crossing the plane coil(12) in the delivery, the change of conducting wire formed the plane coil(12) is prevented. Therefore, the generation of disconnection with the contact between conducting wires are prevented.