CHIP CARD, ITS MANUFACTURING METHOD AND SEMICONDUCTOR CHIP USED IN CHIP CARD

摘要

PURPOSE: A chip card, its manufacturing method and a semiconductor chip used in the chip card are provided to endure a bending load and simplify component arrangements rather than a conventional chip module. CONSTITUTION: A chip card comprises a card body(1), a cavity(2), a plurality of contact surfaces(3), a semiconductor chip(4) and contact terminal(11). The contact surfaces(3), made of electric conduction material, is electrically contacted to the contact terminals(11) assigned to an electronic circuit formed on a semiconductor base plate(10) of the semiconductor chip(4). The contact surface(3) is manufactured on a main surface of the semiconductor chip(4) directing toward a coating type electronic circuit, and the semiconductor chip(4) is fixedly inserted into the cavity(2) of the card body(1) to make the contact surface(3) extended in the same plane of an external surface(7) of the card body(1).