TERMINAL LAND FRAME, SEMICONDUCTOR DEVICE OF RESIN MOUNTING TYPE AND PRODUCING METHODS THEREOF

摘要

PURPOSE: A semiconductor device mounting a substrate from a lower surface side is provided to improve reliability and to lower producing cost by preparing an instrument for forming the semiconductor device by using a frame body. CONSTITUTION: A terminal land frame composed of a frame main body and plural land assembling bodies(28) is prepared. Then, the terminal land frame is installed for the projected part of the land assembling body to locate at the upper area. Also, a conductive adhesive is interposed on a first land assembling body for loading a semiconductor chip(30) for attaching the semiconductor chip to the first land assembling body. And, the semiconductor chip and a second land assembling body are electrically connected by using a metal wire(31) for being mounted by using a mounting resin(32). An end part of the terminal land frame is attached while releasing the mounted area for pressurizing to the lower surface of the land assembling bodies upwardly. And then, the land assembling bodies are separated from the frame main body of the terminal land frame for completing the semiconductor device of resin mounting type.