| 摘要 |
<p>The present invention provides a thermosetting adhesive composition that solves the problems of reactive hot melt adhesives of the prior art and that can be used as a heat bonding type adhesive with a high flow resistance during thermocompression bonding and a high soldering heat resistance. The thermosetting adhesive composition comprises an adhesive component containing (a) a polyethylenic copolymer with an epoxy group in the molecule and (b) a rosin, characterized in that the rosin has a carboxyl group in the molecule and the adhesive component further contains an inorganic colloid dispersed therein.</p> |
