| 摘要 |
<p>A method of manufacturing a wiring board, characterized by comprising a step of disposing a peelable sheet, which has an opening corresponding to a through hole to be resin packed, on at least one surface of a substrate or substrate layer while aligning the openings with the through hole-carrying substrate or substrate layer; a step of forming a resin sheet, which is softened by heating, or solidified by cooling or curing, on the surface of the substrate which is provided with the peelable sheet; and a resin packing step including a step of burying a part of the resin sheet in the through hole while softening the resin sheet with heat and under pressure, and then solidifying the resin by cooling or curing, and a step of separating the peelable sheet from the substrate or substrate layer; this resin packing step enabling the packed resin to rarely encounter the occurrence of a defect, and the resin to be suitably packed in the through hole by using an inexpensive material and a simple step.</p> |
