| 摘要 |
PURPOSE: A hybrid module is provided to mount with a high density and have a high reliability and a high heat emitting property by installing a chip part of multilayer condenser or multilayer inductor and circuit part of semiconductor device on a PCB(Printed Circuit Board). CONSTITUTION: A hybrid module(10) is composed of: a PCB(11) having a circuit pattern, plural chip shaped electronic components(12) mounted in the PCB(11), and a circuit component(13) like a semiconductor device having a heat emitting property mounted on the PCB(11). The PCB(11) is a rectangular laminated print board formed by plural heat insulating layers(14) and a conductive electrode layer(15). At a lower surface of the PCB(11), in other words, at a circumferential surface(16) faced with a main PCB when mounting to the main PCB, a depressed part(17) for loading the circuit component(13) is formed. By the hybrid module(10), the PCB(11) is formed by the laminated PCB and a mounting density of the circuit component(13) is improved because the circuit component(13) is mounted at the depressed part(17) formed at the peripheral surface(16) of the PCB(11). Also, the circuit component(13) is attached at a heat emitting electrode(15a) exposed at the depressed part(17) of the PCB(11) and then the heat generated from the circuit component(13) is effectively conducted to the heat emitting electrode(15). |
