FRAME FOR SEMICONDUCTOR PACKAGE AND METHOD FOR PRODUCING SEMICONDUCTOR PACKAGE USING FRAME

摘要

PURPOSE: A frame is provided to have a reinforcing function for supporting a solder ball and a circuit board sheet and a method for producing a semiconductor package using the frame. CONSTITUTION: A frame(10) for a semiconductor package contains a body(12) formed in a flat square ring shape, many reinforcements(14) formed in a square ring shape for placing a circuit board sheet and a semiconductor chip inside the body, and many connectors(16) connecting many reinforcements to the body and supporting the reinforcements by connecting each other. The reinforcements are naturally stuck to the circuit board sheet by cutting a cut unit formed on the connector so that the process is simple and the materials are prevented from wasting. The frame is produced by using a mechanical stamping and a chemical etching method.