ENCAPSULATED MICRO-RELAY MODULES AND METHODS OF FABRICATING SAME

摘要

PURPOSE: An improved low cost micro-relays and methods of fabricating same are provided to lower the inefficiency in using earlier micro-relays. CONSTITUTION: A micro-relay module(10) includes a substrate(11) and a lid(12) in spaced apart relation, and a solder ring(13) which bonds the lid to the substrate to define a chamber(14) therebetween. A micro-machined relay(15) is integrally formed on the substrate or on the lid within the chamber. A bonded solder ring is used to enclose high pressure gas at pressures of up to 20 atmospheres or more in the chamber. Input/output pads(16) are included outside the chamber and electrically connected to the micro-machined relay. Large numbers of encapsulated modules may be fabricated on a single substrate by integrally forming an array of relays on a face of a first substrate. A second substrate is placed adjacent the face with a corresponding array of solder rings therebetween, such that a respective solder ring surrounds a respective relay. The solder rings are reflowed in a gas atmosphere which is above atmospheric pressure to thereby form an array of high pressure gas encapsulating chambers. The first and second substrates are then unified for form a plurality of individual micro-relay modules.