A PROCESS FOR MAKING A HEATER CHIP MODULE

摘要

A process is provided for forming a heater chip (160) module comprising a carrier (52) adapted to be secured to an ink-filled container, at least one heater chip having a base coupled to the carrier, and at least one nozzle plate (70) coupled to the heater chip. The carrier includes a support substrate (54) having at least one passage which defines a path for ink to travel from the container (22) to heater chip. The heater chip is secured at its base to a portion of the support substrate. At least the portion of the support substrate is formed from the material having substantially the same coefficient of thermal expansion as the heater chip base. A flexible circuit is coupled to the heater chip module such as by TAB bonding or wire bonding.