| 摘要 |
A process for producing IC card consisting of a top sheet (1), a base sheet (2), and an interlayer sheet (3) carrying IC module (4), said interlayer she et (3) being lain between said top sheet (1) and base sheet (2) and said IC module (4) being laid on or embedded in said interlayer sheet (3), characterized in that said top (1), base (2) and interlayer (3) sheets are subjected to a contact bonding process with a reactive polyurethane hot melt resin under reduced pressure.
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