GRINDSTONE OF RESIN FOR POLISHING SEMICONDUCTOR WAFER, PREPERATION THEREOF, AND METHOD OF POLISHING SEMIDONCUDTOR WAFER, DEVICE AND APPARATUS

摘要

PURPOSE: A grindstone is provided to prevent a semiconductor wafer from being scratched or cracked and to flatten the surface of the wafer without employing expensive slurry as a polishing agent. CONSTITUTION: A grindstone is prepared by the steps of: mixing a resin material with a polishing agent at a ratio of 18-33 to 18-33% so a grindstone as to have the porosity in a range of 45-55%; filling a molding frame with the final mixed powder; and molding the grindstone by compressing the mixed powder at a molding temperature of 100-200°C.