发明名称 DEVICE MODULE OVERLAPPED IN ONE IDENTIFIED PACKAGE
摘要 PURPOSE: A laminated SAW(Surface Acoustic Wave) is provided to be produced by laminating another device such as a capacitor or an inductor on one device. CONSTITUTION: Two separated SAW devices or a filter is used to produce a laminated SAW. Each is maintained by a board put on a gap in a sealed package(11). Two piezoelectric boards(211,212) contain two SAW devices(31,41). The first board is put on the inner surface of the sealed package. The SAW device(31) formed on the surface of the first board is electrically connected to a metallization formed on the same surface with the SAW device by wires(311,312). The second piezoelectric board is fixed at another gap formed in the sealed package while being electrically connected to the metallization formed on the same surface with the SAW device by electric wires(411,412). A sealed lead(61) insulates all the devices from outside. Two connection pads(111,211) form an electric contact with outside of devices.
申请公布号 KR20000029387(A) 申请公布日期 2000.05.25
申请号 KR19990047151 申请日期 1999.10.28
申请人 THOMSON-CSF 发明人 LIGHT PETER
分类号 H03H9/25;H01L23/02;H03H9/05;H03H9/10;(IPC1-7):H01L23/02 主分类号 H03H9/25
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