| 发明名称 |
A linear CMP tool design using in-situ slurry distribution and concurrent pad conditionning |
| 摘要 |
<p>An apparatus for multiple component slurry distribution during semiconductor wafer polishing operations. Concurrent polishing pad conditioning is obtained by means of a novel polishing pad design where polishing pads are mounted in a cylindrical configuration as opposed to the conventional flat surface configuration. A polishing pad conditioner is provided to refurbish the polishing pad. <IMAGE></p> |
| 申请公布号 |
EP1002626(A2) |
申请公布日期 |
2000.05.24 |
| 申请号 |
EP19990480059 |
申请日期 |
1999.07.09 |
| 申请人 |
CHARTERED SEMICONDUCTOR MANUFACTURING PTE LTD. |
发明人 |
SUDIPTO RANENDRA, ROY |
| 分类号 |
B24B37/04;B24B53/007;B24B57/02;B24D13/12;H01L21/304;(IPC1-7):B24B37/04 |
主分类号 |
B24B37/04 |
| 代理机构 |
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代理人 |
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| 地址 |
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