| 摘要 |
<p>A wafer marking is disclosed, which is represented by a large number of soft marks incorporated into a surface of a wafer. The soft marks each have a depth of at least 4 mum, an internal diameter of at least 50 mum and, in a particularly advantageous manner, a minimum gradient their surface of 0.2. These depressions can be proded, using appropriate technology, with depths of up to mum.</p> |
