Method of manufacturing a circuit assembly from two or more layers of flexible film

摘要

A method of manufacturing an electronic circuit assembly that includes a number of electrically interconnected flexible films, each flexible film having a flexible electrical wiring circuit. The electrical wiring circuits are interconnected between film layers and the film layers are adhered to a moulded backing structure within an open mould. After the mould has been closed, a plastic material is injected within the mould and this adheres to the first and second flexible films and forms an integral backing structure.