| 摘要 |
A heat exchanger is preferable to be applied to intercoolers, radiators and cooling means in semiconductor circuits and improved in heat exchanging efficiency by provision of gas paths that are formed with porous metal bodies large in heat-transfer surface. The heat exchanger includes porous metal bodies(1,21) having intercommunicating porosity to provide gas-flow paths(4,24) for suction air(IA) and to make the heat-transfer surface larger, porous metal bodies(1,21) being made of metal such as aluminum or aluminum alloy high in thermal conductivity. The porous metal bodies(1,21) are pierced with tubular elements(2) in which cooling water flows through. The porous metal bodies(1,21) may be fabricated by preparing a mold of foamed urethane resin filled with salt cores, pouring a metal having a melting temperature lower than that of the salt cores in to the mold. <IMAGE> |
