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发明名称
Method of manufacture for a wire wound electronic component
摘要
申请公布号
GB0008556(D0)
申请公布日期
2000.05.24
申请号
GB20000008556
申请日期
1998.08.17
申请人
TAIYO YUDEN CO.LTD.
发明人
分类号
H01F17/00;H01F17/04;H01F27/02;H01F27/29;H01F41/00;H01F41/02;H01F41/04;H01F41/12;H05K9/00
主分类号
H01F17/00
代理机构
代理人
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地址
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