发明名称 METHOD AND APPARATUS FOR CUTTING WORK
摘要 PROBLEM TO BE SOLVED: To efficiently feed fluid such as abrasive solution, reacting gas or the like to a cutting part wherein cutting work is being advanced without using a highly precise and expensive apparatus. SOLUTION: In this method, a silicon ingot 1 is cut into a large number of sliced while reacting gas is fed to the working part by a wire electrode line 4 from a gas feed nozzle 11. Then, a cut groove to be generated by the cutting work is hermetically sealed by a curtain 10 which is disposed in tension and wound on an outer peripheral surface of the silicon ingot 1 so that the cut groove can be hermetically sealed excepting the feed part of the reacting gas to the cut grove. Further, cutting is executed while the reacting gas is being fed to a hermetically sealed space.
申请公布号 JP2000141363(A) 申请公布日期 2000.05.23
申请号 JP19980323380 申请日期 1998.11.13
申请人 MITSUBISHI HEAVY IND LTD 发明人 ASANO SHIN;SHIGENAKA TOSHIAKI
分类号 B28D5/04;H01L21/304;(IPC1-7):B28D5/04 主分类号 B28D5/04
代理机构 代理人
主权项
地址