发明名称 |
Metal polishing agent and process for polishing metal using same |
摘要 |
There is provided a metal polishing agent comprising an aqueous emulsion comprising a complexing agent capable of reacting with a metal to form a water soluble metal complex and a resin particle prepared by emulsion polymerization of a vinyl compound, which is particularly useful for polishing a metal film formed on a silicon wafer by a chemical and mechanical polishing. |
申请公布号 |
SG72887(A1) |
申请公布日期 |
2000.05.23 |
申请号 |
SG19980004711 |
申请日期 |
1998.11.13 |
申请人 |
SUMITOMO CHEMICAL COMPANY, LIMITED |
发明人 |
TAKASHIMA MASAYUKI;SAWARA KENICHI;SUKUMODA ATSUSHI |
分类号 |
B24B37/00;C08J5/14;C09G1/02;C09K3/14;C23F3/00;H01L21/304;H01L21/321 |
主分类号 |
B24B37/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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