发明名称 LAMINATE BASE AND ITS MANUFACTURE
摘要 <p>PROBLEM TO BE SOLVED: To manufacture a printed-wire board base of appropriate density for making compatible the proper fiber orientation with the uniform basis weight each other and satisfying the process strength in the prepreg manufacturing stage. SOLUTION: A laminate base is formed of a plurality of wet nonwoven fabric composed of para-Aramid fibers and a thermosetting resin binder as main components and containing 95-70 wt.% para-aramid fibers and a 5-30 wt.% thermosetting curable resin binder and being stuck all together. The laminate base contains totally 3-300 wt.% thermoplastic resin fibers of 220 deg.C or higher softening temperature and/or thermosetting resin fibers of 120 deg.C or higher glass transition temperature to totally 100 wt.% para-Aramid fibers and the thermosetting resin binder.</p>
申请公布号 JP2000141522(A) 申请公布日期 2000.05.23
申请号 JP19980328242 申请日期 1998.11.18
申请人 OJI PAPER CO LTD;SHIN KOBE ELECTRIC MACH CO LTD 发明人 UENO HIROYOSHI;KATO YOSHIHISA;ICHIOKA ISAO;ADACHI BUICHI;MURATA MAMORU;HIRAOKA KOICHI;OCHITA MANABU;NODA MASAYUKI
分类号 B32B5/02;B32B5/26;B32B37/10;C08J5/24;D21H13/26;D21H17/52;D21H21/18;D21H25/06;D21H27/00;D21H27/30;H05K1/03;(IPC1-7):B32B5/02;B32B31/20 主分类号 B32B5/02
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