发明名称 DIE DEVICE FOR FULLY ENCLOSED FORGING AND FULLY ENCLOSED FORGING METHOD
摘要 PROBLEM TO BE SOLVED: To obtain a formed product excellent in quality without any underfill by arbitrarily setting a back pressure to be applied to a counter punch in accordance with a work. SOLUTION: In this die device for fully enclosed forging by which cavities 1a, 2a are enclosed between an upper die 1 and a lower die 2, by pressing/ branching a work 7 in the cavities 1a, 2a with an upper counter punch 8 and a lower counter punch 22, the work 7 in the cavities 1a, 2a is subjected to fully enclosed forging, pressing means 11, 19, in which the cavities 1a, 2a are both side-enclosed by pressing the upper die 1/lower die 2 from up/down directions, are arranged, a back pressure imparting means, in which the work 7 is both side-branched by imparting a back pressure smaller than a forming load to upper/lower counter punches 8, 22 in forming, is arranged above the upper counter punch 8 and below the lower counter punch 22, the back pressure imparted by the back pressure imparting means is arbitrarily set in accordance with the work 7 by a back pressure setting means, by arbitrarily setting corresponding to the work 7, the formed product excellent in quality without any underfill is easily obtained.
申请公布号 JP2000140978(A) 申请公布日期 2000.05.23
申请号 JP19980318895 申请日期 1998.11.10
申请人 KOMATSU LTD 发明人 MATSUMOTO ISAMU;MITSUYOSHI KOJI
分类号 B21J5/02;B21J13/02;(IPC1-7):B21J5/02 主分类号 B21J5/02
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